| Customization: | Available |
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| Application: | Auto and Motorcycle Accessory, Hardware Tool, Machinery Accessory, Cooling System |
| Standard: | GB, EN, API650, China GB Code, JIS Code, TEMA, ASME |
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Product Parameter
1. Precision stamping part,CNC machining part,turned part
2. Tolerance: ± 0. 01 - ± 0.1mm
3. Certificate: ISO 9001
4. Total customer satisfaction
| Description | Product Attribute |
| Manufacturer | Wanda-an |
| Product Category | Heat Sinks |
| Product | Heat Sinks |
| Designed for | Solid State Relay - SSR |
| Mounting Style | DIN Rail |
| Heatsink Material | Aluminum |
| Fin Style | Extruded Axial Fin |
| Thermal Resistance | 1.2 C/W |
| Length | 90 mm |
| Width | 81 mm |
| Height | 80 mm |
| Color | Black |
| Packaging | Each |
| Product Type | Heat Sinks |
| Series | HS |
| Subcategory | Heat Sinks |
1. Fin Type Heat Sink
Description: This is the most common and traditional type. It consists of flat metal fins that are arranged in parallel or staggered patterns to increase the surface area for heat dissipation.
Application: Used in many electronics, computers, and power devices where space is not too restrictive.
Types of Fin Configurations:
Straight Fin: Simple parallel fins, typically used in standard applications.
Staggered Fin: Fins are slightly offset, increasing surface area and airflow efficiency.
Radial Fin: Fins radiate outward in a circular pattern, typically used for compact, cylindrical devices.
2. Pin Fin Heat Sink
Description: These heat sinks have a series of cylindrical pins (instead of flat fins) to increase surface area. The pins can be arranged in a grid or random pattern, and this design enhances airflow between the pins.
Application: Commonly used when airflow is limited or in situations where small spaces require high surface area.
Benefits: Great for environments where air circulation is not optimal, as the pins allow for better heat dissipation through natural convection.
3. Plate Type Heat Sink
Description: A simple flat plate made from a thermally conductive material like aluminum. Heat is transferred across the surface, and fins or pins can be added to the plate for enhanced heat dissipation.
Application: Typically used in low-power electronics or when space and weight are not major concerns.
Benefits: Simple and cost-effective design.
4. Heat Pipe Heat Sink
Description: Heat pipes are used within the heat sink to transfer heat from one point to another with very high efficiency. The heat pipe contains a liquid that evaporates at the hot end and condenses at the cooler end, transferring thermal energy along the length of the pipe.
Application: Used in high-performance computing, graphics cards, and laptops where efficient thermal management is critical.
Benefits: Efficient for cooling small devices that generate significant heat and for applications where space is limited.
5. Vapor Chamber Heat Sink
Description: Similar to a heat pipe, but instead of using a single pipe, a vapor chamber uses a flat, sealed enclosure containing a small amount of fluid. The fluid evaporates at the hot end and condenses at the cooler end, transferring heat effectively.
Application: Often used in high-end processors, servers, and gaming laptops to ensure better uniformity in heat distribution.
Benefits: Provides efficient cooling over a larger area, especially in situations with dense heat generation.
6. Active Heat Sink
Description: These heat sinks incorporate a fan or other active cooling method to force air over the heat sink surface, increasing heat dissipation. The fan is typically mounted on top of or integrated into the heat sink.
Application: Found in applications where passive cooling (using only natural convection) is not sufficient. Examples include computer CPUs, graphics cards, power electronics, and servers.
Benefits: Significantly increases heat dissipation capacity but adds complexity and noise.
7. Passive Heat Sink
Description: A passive heat sink relies entirely on natural convection (without any active cooling like fans). It uses a combination of large surface area and heat conduction to dissipate heat into the surrounding air.
Application: Used in quieter environments, or when energy consumption and space are a concern. Examples include low-power electronics and industrial machinery.
Benefits: Simple, reliable, and noiseless, but less efficient than active heat sinks in high-heat environments.
8. Extruded Heat Sink
Description: These heat sinks are made by extruding a metal (often aluminum) into a specific shape, such as fins or blocks. This process allows for a continuous design and is often used in mass production.
Application: Common in consumer electronics, power supplies, and automotive applications.
Benefits: Cost-effective, customizable, and great for large-scale manufacturing.
9. Bonded Fin Heat Sink
Description: These heat sinks are made by bonding fins to a solid base using soldering or adhesive methods. The fins are usually flat and provide a larger surface area for heat dissipation.
Application: Used in applications requiring high performance where heat needs to be efficiently dissipated from a small area.
Benefits: Offers good thermal performance and flexibility in design.
10. Sintered Metal Heat Sink
Description: These heat sinks are made from metal powders that are sintered together at high temperatures to form a porous structure. The material can provide more surface area for heat dissipation.
Application: Used in high-performance applications where a high thermal capacity and enhanced heat dissipation are required.
Benefits: Great for managing heat in environments with limited airflow.
11. Cold Plate Heat Sink
Description: A cold plate is a flat surface that includes channels for liquid coolant to flow through, which absorbs and carries away heat from the component.
Application: Used in high-power electronics or industrial applications where liquid cooling is an option.
Benefits: Very efficient at removing heat but more complex to set up and requires a liquid cooling system.
12. Heat Sink with Phase Change Material (PCM)
Description: This type of heat sink uses a phase change material (like paraffin wax) that absorbs heat by changing its phase (from solid to liquid), which helps absorb thermal energy more effectively.
Application: Used in situations where you need to store and release thermal energy over a longer period, like in electronics exposed to varying workloads.
Benefits: Helps in situations where there are rapid temperature changes, as PCMs can absorb significant amounts of heat without dramatically increasing temperature.
13. Composite Heat Sink
Description: These heat sinks are made from two or more materials, such as aluminum combined with copper, to combine the thermal properties of each material. Copper has excellent thermal conductivity, while aluminum is light and inexpensive.
Application: Used in applications that require both high thermal conductivity and cost-effectiveness, like in computers or LED lighting.
Benefits: Optimized for higher performance and reduced weight.
The Aluminum Heat Sink Applications
Precision: Commitment to delivering precision-engineered components that meet or exceed customer expectations.
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